Early photos of Microsoft's next-generation Xbox console system chip (codenamed Magnus) are suspected to have been leaked.Hardware leaker Moore's Law Is Dead (MLID) showed off physical photos of what it said is the next-generation Xbox Magnus chip in its latest YouTube video, while also providing an in-depth explanation of the chip's leaked parameters and comparison with the PS6's rumored specifications.

According to the tipster, the Xbox Magnus chip uses TSMC’s 4nm process technology and is equipped with 16 Zen 5 architecture CPU cores and 60 sets of RDNA 5 architecture GPU computing units.In terms of memory configuration, it is suspected to use 24GB GDDR7 video memory, which will achieve a significant increase in bandwidth compared to this generation of hardware.MLID specifically pointed out that the leaked information indicates that Microsoft may abandon the "cheap and weakened version" strategy adopted by Xbox Series S. Magnus is obviously positioned as a high-end flagship hardware that can benchmark or even surpass the PS6 base model.He believes that Microsoft may try to synchronize with Sony or release a new console in advance to revitalize the market momentum.

According to leaked information and MLID analysis, the performance gap between Xbox Magnus and PS6 may be closer than that of the previous generation.Although the final clock speed and model variant have not yet been confirmed, both consoles are rumored to use Zen 5 CPU architecture and RDNA 5 GPU architecture, but Magnus has a slight advantage in the number of GPU computing units (about 60 units compared to 56-60 units in the base PS6 model).

Although this may give Microsoft a slight advantage in graphics processing power, Sony is expected to respond with more mature developer tools and in-depth software and hardware co-optimization.MLID emphasized that although Magnus may have an advantage in terms of parameters, actual performance will still depend on the main frequency setting, memory configuration, and the two manufacturers' control strategies for heat dissipation and power consumption.