With the official announcement of Nintendo Switch 2, the three companies have begun to enter a new round of console war.According to the latest rumors, the SoC design of Sony PS6 has been completed.

The first production of the chip will be put into production later this year, the report said.Judging from Sony's record of producing gaming consoles, the final hardware will be released two years after the first A0 chip is produced, which is around 2017.

In addition, earlier reports said that the GPU of PS6 will be based on UDNA, the next generation variant of AMD RDNA technology.Previously, there were reports that UDNA will bring AMD back to the flagship GPU market after three years.

Recently, my uncle from China revealed that the PS6 host will be equipped with AMD's 3D stacking technology.3D stacking has shined on the Ryzen X3D desktop processor and has become the strongest CPU for gamers.3D stacking will combine different core IP stacks and 3DV-Cache technologies. By stacking L3 caches together, these cores can greatly improve CPU bandwidth, which is expected to greatly improve performance and energy efficiency.

PS6 will further expand the PSSR technology, which was revealed to affect the development of FSR 4.Machine learning will be an important aspect of PS6 development and is expected to surpass all next-generation hosts.